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1.XC板層數(shù)評(píng)估:XC板中最復(fù)雜的器件為U1,是BGA封裝的;信號(hào)深度為6排,每?jī)膳判枰?個(gè)信號(hào)層進(jìn)行走線,需要3個(gè)信號(hào)層來(lái)走線(TOP層、內(nèi)部?jī)蓚(gè)信號(hào)層),考慮到還有電源層和地層,最少需要5層,由于PCB是偶數(shù)層,所以至少是6層板;PCB層數(shù)分布大致如下:TOP,GND02,Signal03,Signal04,PWR05,BOTTOM;
2.STM32板封裝導(dǎo)入,元器件預(yù)布局,3D封裝創(chuàng)建;
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